钨铜合金表面化学镀Ni-P镀层性能研究

PERFORMANCE OF ELECTROLESS Ni-P COATING ON W-Cu ALLOY

从钨铜合金表面化学镀Ni-P镀层的表面形貌及成分,镀层结构,外观,结合力,硬度,耐磨性,孔隙率,纤焊性等方面进行了检测和表征.结果表明,化学镀Ni-P合金层磷含量为11.37%,属于高磷镀层,主要为非晶型结构,在钨铜合金表面化学镀Ni-P合金可以大大提高钨铜合金的硬度和耐磨性,且Ni-P合金镀层与钨铜合金基体结合强度好,孔隙率低,纤焊性好.

The surface morphology and composition, microstructure, appearance, adhesion, hardness, antiabration ability,porosity ratio, solder ability and corrosion resistance of electroless Ni-P alloy plating on W-Cu alloy were investigated. The result indicates that the Ni-P alloy coating belongs to high phosphorus coating with P content 11.37 wt. % and it is amorphous in nature, and the anti-abrasion ability and hard- ness of W-Cu alloy was greatly improved by electroless Ni-P alloy plating. Meanwhile, the Ni-P alloy coating has a qualified adhesion with W-Cu alloy substrate with lower porosity ratio and good solderability and the deposit can offer fairly good protection to W-Cu alloy substrate in 3.5 wt. % NaC1 solution, artificial sweat solution and 10% H2SO4 solution.