摘要
本文针对高速PCB板信号接地设计中存在接地噪声及电磁辐射等问题,提出了高速PCB接地模型,并从PCB设计中布线策略的分析和去耦电容的使用等几个方面讨论了解决高速PCB板的接地噪声和电磁辐射问题的方法。
Because of the existence of the ground noise and the electromagnetic radiation in the high - speed PCB board design, this paper proposes a simple ground model in high - speed PCB board design, and discusses the solution to solve the ground noise and the electromagnetic radiation in the high - speed PCB board design from the aspects in analysis of wiring strategy and the use of capacitive coupling.
出处
《信息技术与信息化》
2009年第2期77-79,共3页
Information Technology and Informatization
