全自动晶片焊线机视觉检测系统的研究

Study on the Vision Detection System of Automatic IC Wire Bonder

全自动晶片焊线机是晶片生产的关键设备之一,其视觉系统是设备的核心技术所在。视觉系统决定了晶片的检测和定位精度。介绍了基于机器视觉的全自动晶片焊线机的专用芯片视觉检测系统的工作原理和设计结构,着重阐述了视觉系统的软件和硬件设计过程,以及用于晶片检测定位的图像处理算法。实验表明,系统在速度和精度上都可满足焊线生产的需求,对于自动晶片焊接设备的自动化、智能化和产业化有一定的参考意义。

The automatic wire bonding machine is one of the primary equipments for chip production. The machine vision system is very crucial in the process of wire-bonding, and it defines the measure and the location accuracy of wafers. The structure and priciple of vision detection system for special wafers in high precision chip wire-bonder were introduced. The design of the hardware and software of the system were discussed, at the same time the arithmetic of image processing for the measure and the location of wafers was presented. Experiment results show that the method can effectively detecte and locate the chip. The speed and accuracy of the system are good enough to meet the practical application requiremens, it has great reference value for robotization, intelligentization and industrialization of automatic wire bonding machine.