大功率激光二极管无助焊剂烧焊技术

Fluxless Soldering Technology for High Power Laser Diode

烧焊质量对大功率激光二极管的可靠性及寿命影响很大。为获得良好的烧焊质量通常在烧焊过程中使用助焊剂,但是助焊剂残留物会因腐蚀作用对激光二极管的性能及寿命产生不利影响。对蚁酸气体保护下的激光二极管无助焊剂烧焊技术进行了研究,介绍了几种去除焊料表面氧化层的方法,重点对蚁酸气体保护的烧焊进行了原理分析,并结合实际经验给出了合适的工艺曲线,利用此曲线烧焊出一定数量的样品,与氢气保护烧焊的器件进行了相关参数比较,证实了蚁酸保护烧焊在焊料的浸润性、器件的热阻及剪切力方面具有明显优势。

Soldering quality is an important factor to the reliability and life of high power laser diode. To obtain good solder quality, flux is often used during soldering process, but the flux residue would affect the performance and life of laser diode for its etching effect. A fluxless soldering technology of high power laser diode by using formic acid was investigated. Several methods upon reducing oxidation at the interface of indium solder were introduced, especially the using of formic acid, and a proper process curve was obtained. Through comparing the wettability, thermal resistance and die shear strength of the different soldering processes, it is determined that the results from soldering using formic acid is much better than from hydrogen.