人造单晶金刚石激光微孔加工技术研究

Study on laser micro-drilling technology for synthetic single crystal diamond

人造单晶金刚石传统的激光打孔方法采用"轮廓法"。该方法的缺点是越靠近孔的中心剥去的材料越多,精确的孔型难以得到。本文在理论和实践的基础上,提出了一种新的激光数控打孔自适应模型。在模具的压缩区,通过控制工件的转速实现材料的均匀去除,并且使激光脉冲能量随着孔径的减小而递减,以提高孔型精度。结果表明,该模型可以有效提高微孔的加工精度,最小加工孔径达到3.5μm。理论和实践证明,本文提出的激光打孔数控模型是人造单晶金刚石激光打孔的有效方法。

Outline shaping method a conventional laser micro-drilling technology for drilling synthetic single crystal diamond. The disadvantage of this technology is that the nearer to the hole center the laser focus is , the more the removed materials are. Accordingly, it is difficult to obtain an accurate pass. Based on the theory and experiment, a new model for laser numerical control drilling is proposed . In the reduced area, the material is removed equally by automatic regulating of the dies＇ rotating speed. Furthermore, the laser pulse energy is controlled to decrease with the reduction of the aperture, which correspondingly improves the pass precision. The experimental results show that the proposed model can improve the machining precision of the dies efficiently . An aperture of 3.5 μm can be obtained . It is proved that the model proposed in this paper for diamond drilling is successful and effective for micro-nano fabrication of integrated circuit lead dies.