摘要
塑料封装器件由于湿热导致层间开裂是影响器件可靠性的关键问题之一。采用有限元分析软件模拟和计算了不同的模塑封材料(EMC)尺寸的PBGA(塑封焊球陈列)器件在358.15K、RH60%条件下吸潮168h和398.15K、RH0环境下干燥50h后器件内部的应力对界面可靠性的影响。结果表明,在吸潮情况下,EMC厚度为0.85mm的器件的界面可靠性最低,最大湿应力为0.528MPa;在干燥阶段,EMC厚度为1.25mm的器件的界面可靠性最高,最大湿应力仅为0.124MPa。
The interface crack caused by hot moisture absorption in plastic packaging devices is a main problem of the reliability of the devices. Finite element analysis software was used to simulate the influence of inner stress of PBGA device with different EMC sizes on interfacial reliability at 358.15 K, RH 60% for 168 h and 398.15 K, RH 0 for 50 h. The results show that in the hot moisture absorption phase, the interface reliability of the device with EMC thickness of 0.85 mm is the lowest, the maximun wet stress is 0.528 MPa; in the dry step, the interface reliability of the device with EMC thickness of 1.25 mm is the highest, the maximun hygro-thermal stress is only 0.124 MPa.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2009年第6期69-73,共5页
Electronic Components And Materials
基金
国家自然科学基金资助项目(No.60666002)
