单搭接接头温度场与热应力分布的研究

Temperature and Thermal Stress Distribution in Single Lap Joint

为了对胶接接头承受热载荷时的温度场和热应力分布进行数值模拟,利用有限元法对单搭接接头的被粘物外表面承受不同温度、速度气流时的温度分布情况进行了分析。在考虑接头变形为几何非线性的前提下,研究了约束方式、胶层厚度及搭接长度对接头热应力分布的不同影响。结果表明,峰值热应力出现在搭接区边缘;当约束方式使胶层发生较大转动时,胶层处于高应力水平;随胶层厚度的增加,热应力降低且在胶层中分布更趋于均匀;搭接长度对热应力的影响因接头所受约束方式的不同,呈现不同的规律。

In order to make numerical simulation for temperature field and thermal stress of adhesive joints under thermal loads, the temperature distribution of adhesively bonded single lap joint （ SLJ）, whose surfaces are subjected to air flows with different temperature and velocity, is analyzed using finite element method. Also, considering the geometrical non - linear deformation of SLJ, the effects of various factors such as boundary condition, thickness and overlap length of adhesive on the thermal stress distribution in SLJ are investigated. The simulation results show that the peak thermal stress is near to the edge of the lap region. When the boundary condition makes larger rotations in adhesive layer, stresses in adhesive are at high level. With the increase of thickness in adhesive layer, thermal stresses decrease and tend to more uniform. Furthermore, with the change of boundary conditions, the influence of overlap length on thermal stresses has its different changing rules.