C_f/Al-4.5Cu 复合材料界面微结构的研究

Study of Interface Microstructure of C_f/Al_45Cu Composites

利用挤压铸造法制造了Ｃｆ／Ａｌ４５Ｃｕ复合材料，并在透射电子显微镜上分析了其界面的微观结构特征。结果表明：Ｃｆ／Ａｌ４５Ｃｕ复合材料界面存在ＣｕＡｌ２与Ａｌ４Ｃ３析出相，Ａｌ４Ｃ３呈细棒状，而ＣｕＡｌ２相表现为柱状、块状和片状；由于碳纤维与Ａｌ４５Ｃｕ基体间热膨胀系数不匹配产生的热应力及挤压铸造过程中Ａｌ４５Ｃｕ基体产生塑性变形，使得在界面附近的基体中和ＣｕＡｌ２相中产生大量位错缺陷。Ｃｆ／Ａｌ４５Ｃｕ复合材料界面具有“轻微反应型界面”的典型特征，适度界面反应有助于复合材料本身机械性能的提高；但是ＣｕＡｌ２相在界面上析出却对复合材料的性能产生极大的危害。

In the paper,C_f/Al_45Cu composites was fabricated by squeeze cast method,and then the interfacial microstructures of C_f/Al_45Cu composites have been studied by TEMExperimental results show that there were CuAl_2 and Al_4C_3 phase on the interface of C_f/Al_45Cu composites,the shape of Al_4C_3 phase showed as the sticklike,and the shape of CuAl_2 phase respectively showed as the pillarlike,chunklike and slicelikeWhen the composites was cooled from elevated temperatures of processing,misfit strains occurred due to differential thermal contraction at the C_f/Al_45Cu interface which were sufficient to generate dislocations in the matrix and CuAl_2 phaseC_f/Al_45Cu composites possessed the typical character of the interface reacted slightly,suitable interface reaction would be conductive to improve the mechanical properties of the composites,but the produced CuAl_2 phase on the interface would be harmful to the properties of the composites