浅析SMT回流焊接缺陷分析

SMT Reflow Soldering Defect Analysis

表面组装技术(SMT)的应用是电子装联时代的一场革命,随着电子装联的小型化、高密度化的发展,随着无铅焊接工艺的应用,回流焊接的工艺方法受到了越来越多的挑战。要完成高质量和高直通率的电子产品,对焊接缺陷必须具备较强的诊断和分析能力,找出产生缺陷的相关因素,改善工艺过程,找出最好的办法有效地控制缺陷率。最大化提高产品的品质,最大化降低返工或返修造成的成本是SMT业者一个永远追求的目标。本篇论文着重讨论部分回流焊接缺陷,给大家一个针对相关缺陷分析的思路和方法。

SMT reflow process is facing more challenges as electronics assembly trend towards small-scale, high-density, and the application of lead-free. It is required to have strong capability of diagnosis and analysis on welding defects in order to attain high quality and high yield products, to find the related causes of the defects, to improve the manufacturing process, and find the best solution to process and control efficiently the defects rate. It is a target for SMT industry to improve the product quality and reduce maximally the rework rate or minimize the cost of rework. This paper will focus on some defects of reflow jointing and provide ideas and methods to analyze related defects.