摘要
IC封装中嵌入的微型电路连接可以通过纳米焦点X光光管技术和纳米焦点CT来检测;包括铜或金焊线、堆叠芯片、倒装焊接、微穿孔连接的封装形式。生动地描述了2维3维X射线影像技术,并且呈现了亚微米分辨率的各种分析结果和缺陷案例。
Miniaturised and concealed electrical interconnections in IC packages including copper and gold wire bonds, stack dies, flip chips and microvias were inspected by nanofocus X-ray tube technology and nanofocus computed tomography. The 2D and 3D X-ray imaging technology is concisely described and various analysis results and defect examples at sub-micrometer resolution are presented.
出处
《电子工业专用设备》
2009年第5期51-54,共4页
Equipment for Electronic Products Manufacturing
