摘要
对磁性元件在灌封后出现裂纹的问题进行了研究。介绍了灌封料对磁性元件的影响,分析了磁件裂纹的原因并进行试验验证。通过在磁件上粘贴胶带设置缓冲层的方式,吸收磁件与灌封料之间的应力,有效解决了灌封后磁性元件裂纹问题,提高了模块组件的可靠性。
Cracks on magnetic components introduced in encapsulation were investigated. Effects of materials for encapsulation on magnetic component were discussed. Causes for cracks on magnetic components were analyzed, and experiments were made for verification. By attaching adhesive tapes on magnetic components as a buffer to absorb stress between magnetic components and encapsulating materials, cracks on magnetic components after encapsulation were avoided, and the reliability of the circuit module was improved.
出处
《微电子学》
CAS
CSCD
北大核心
2009年第3期445-448,共4页
Microelectronics
关键词
灌封胶
功率电源
模块
温度应力
磁罐
裂纹
Encapsulating material
Power supply
Module
Temperature stress
Magnetic component Crack
