激光开槽技术在毫米波产品中的应用

Application of Laser Slotting Technology in Millimeter Wave Products

在毫米波产品设计中,芯片的安装方式及连接路径是影响产品性能的一个重要因素。目前的手工操作方法不能满足高性能产品设计的需要,同时也是批量化生产的工艺技术瓶颈。介绍了一种新型的在电路基片上制作芯片安装槽的激光开槽工艺技术。对机械透铣和激光蚀刻两种工艺技术进行了比较。通过研究和试验,确定了激光设备的工艺参数,在电路基片上制作出精确的芯片安装槽。经应用表明,芯片安装缝隙达到了0.1mm的水平,在键合引线处产生的插损和驻波显著降低。这种技术大幅提高了毫米波产品的装配成品率和生产效率,减小了键合引线引起的寄生效应影响,保证了毫米波产品的设计需要。

In the design of the millimeter wave products, the installation method and connection path for chips are an important attribute that influence the product performance. The present methods of manual operation can＇ t meet the needs of high performance products, which becomes the bottleneck of volume production. A new laser processing technology of slotting for chips on the circuit substrate was introduced. Mechanical mill and laser processing were compared. Through research and experiment, the technological parameters of the laser device were determined, and successfully slot for chips on the circuit substrate. The application shows that the slit of chip installment achieves the level of 0.1 ram, insert loss and the bonding wires are obviously reduced. It indicates that this processing technology can greatly enhance the rate of finished products and the production efficiency, and reduce the parasite of the bonding wires, meet the design needs of the millimeter wave products.