Mo粉化学沉积Cu对Mo-30Cu合金组织性能的影响

Effects of Cu Chemical Plated Mo Powder on Microstructures and Properties of Mo-30Cu Alloy

为改善Mo-Cu合金组织结构和性能,采用分子自组装方法在Mo粉表面沉积一定量的纳米Cu,然后和一定比例的Cu粉混合,经液相烧结后制备出Mo-30Cu合金。通过与传统粉末冶金方法制备的Mo-Cu的组织性能进行了比较,对该合金的致密度、热导率和热膨胀系数等性能进行研究。结果表明,在Mo粉表面沉积的纳米级的Cu能显著提高Mo-30Cu合金的物理性能,改善组织结构,降低致密化烧结温度。

To obtain homogeneous microstructure and excellent properties of Mo-Cu alloy, nano-scale copper was plated on the surface of Mo particle with molecular self-assembly method, and the copper covered Mo powders was mixed with the proper amount of the copper powder, then compacted and sintered. Compared with the Mo-30Cu alloy prepared by conventional process, the mierostrueture, densification, thermal conductivity and coefficient of thermal expansion of the alloy were investigated. The results indicated that the microstructure and properties of Mo-30Cu alloy could be improved remarkably with chemical copper plated Mo powder, meanwhile the sintering temperature of densification is decreased.