紫铜表面高能离子注渗Ni、Al的研究

Study on Nickelizing and Aluminizing Layer by High-Energy Ion on Pure Copper Surface

对紫铜表面进行高能离子注渗Ni、Al试验的对渗层组织、成分分布进行了观察与分析,并同单元注渗Ni实验进行了比较分析。结果表明,紫铜表面高能离子注渗镍的渗层与铜基体结合良好,由表及里镍含量呈梯度分布,紫铜高能离子注渗Ni、Al的渗层组织和渗Ni组织大致相似,渗层表面出现"贫Al现象",即铝向基体扩散,最终主要集中在渗层的中部。

A new surface alloying method, high-energy ion nickelizing and aluminizing process on the surface of pure copper, was introduced in this paper. For the alloyed layer, the microstructure and the distribution of the element contents was observed and measured, compared to nickelizing layer. The results indicate that high-energy ion nickelizing on the copper surface have good effect, and the Ni represented graded distribution. There are not much difference between niekelizing ＆ aluminizing and nickelizing only. The surface of layer has little Al content, because Al diffused into Cu substrate and chiefly distributed in the middle of the layer with much defect.