芯片焊接中焊点自动定位技术的研究

Research of locating bonding points automatically in chip bonding

为实现自动焊接,在已定位芯片的基础上,对自动定位芯片和框架上的焊点进行了研究,提出了一个高效精确的方法。在系统运行初始,人工引导测定保存每对焊点相对于芯片中心的坐标,使得在自动焊接过程中,定位了芯片中心,就得到了每对焊点坐标。芯片在手工粘贴时存在旋转和偏移误差,还需修正每对焊点坐标。该方法实现了高速精确的焊点自动定位。

In order to realize the automatic bonding, locating the bonding points on chip and frame automatically is studied, and a highly-efficient accurate schema is proposed based on chip located already. In the initial running of the system, coordinates of every couple bonding points are measured and restored by manual work. During the automatic bonding, every couple bonding points can be gained easily after locating the chip center. If there exist rolling and excursion since chip is mounted by manual work, the coordinates of every couple bonding points need to be modified. This schema achieves locating the bonding points rapidly and accurately.