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基于Interconnect Matrix结构的多层AHB总线设计与实现 被引量:4

Design and Implementation of Multi-layer AHB Bus Based on Interconnect Matrix Architecture
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摘要 为了解决AHB片上总线有限带宽的问题,文中在其基础上,介绍了一种交叉互连矩阵结构的多层AHB总线,并从各子模块设计、以及各子模块之间的相互通信描述了多层AHB总线设计及其实现。最后对其进行系统级仿真,此总线结构极大地提高了片上系统传输带宽。 In order to slove the problem of OCSAHBlimited bus bandwidth, this paper tells of an interconnect martix architectural multi layer AHB bus based on AHB bus, and describes the design and implementation of the bus according to the designs of various submodules and intercommunication between among them. Finally, the system-level simulation is carried out, and indicates that it could greatly improve the transfer bandwidth of SOC.
出处 《通信技术》 2009年第6期210-213,共4页 Communications Technology
基金 重庆市自然科学基金(CSTC2008BB4083 2007BB4391 KJ060515)
关键词 多层AHB总线 交叉互连 片上系统 multi-layer AHB bus interconnect matrix SOC
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参考文献6

  • 1AMBA Specification Rev 2.0. ARM[S]. 1999. http://www. arm.com
  • 2AHB Example AMBA System - ARM DUI 0092C. ARM[S]. 2001. http://www, arm. com.
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二级参考文献8

  • 1[1]Michael Keating and Pierre Bricaud,Reuse Methodology Manual For System-on-Chip Designs Third Edition[M]:217-238,2002.
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