尼龙-6固相聚合及其性能研究

Study on Nylon-6 Solid State Polycondensation and Its Properties

本文研究了普通尼龙-6和改性尼龙-6切片的固相聚合反应,用(dM)/dt=kt^n描述了其反应动力学,对固相聚合中各种影响因素的探讨表明,抗静电改性剂和反应温度对反应过程的影响很大。用密度梯度法、X-射线衍射法、差示扫描量热法和动态力学法研究了固相聚合过程中尼龙-6的结构和性能的变化。对反应产物热分析过程中出现的双熔融峰作了解释。在实验室试验的基础上,提出了用普通粘度的未萃取切片实行工业化后聚合-脱单体-纺前干燥三步工序一体化,以制取高粘尼龙-6切片的连续和间歇法工艺设计的新思想。

In this paper, the solid state polycondensation(SSP) of Nylon-6 and modified Nylon-6 is studied, its kinetics is stated by dM/dt=Kt^n.The effect of various factors on SSP of Nylon-6 shows that modifying agent and reaction temperature influence the SSP signficantly. The changes of structure and properties of Nylon-6 during SSP are detected by density gradient column, X-ray diffraction, differential scanning calorimetry(DSC) and dynamic viscoelasticity test. The double melting peaks of reaction products detected by, DSC are explained. On the basis of determination of monomer content and other tests, a new continuous or batchwise technical view is put forward in which unextracted Nylon-6 chips with ordinary molecular weight will be turned into high molecular weight products by 'three-in-one'processing step which includes solid state polycondensation, remoyal of monomers and drying of chips.