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工艺参数对真空紫外光直接光CVDSiO_2/Si界面特性的影响

Effects of Deposition Conditions on Interfacial Properties of SiO 2/Si Formed by VUV Light Direct Photo CVD
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摘要 采用高频(1MHz)C-V测试和红外谱,研究了工艺参数对Xe激发真空紫外光(VUV)直接光CVDSiO2的SiO2/Si界面特性的影响。结果表明:衬底温度Ts对固定氧化物电荷密度ΔNot、慢界面态密度ΔNst的影响比反应室总气压Pc和SiH2/O2分压比显著。ΔNot和ΔNst在110°C附近有极小值,大小为1010cm-2量级。Ts>120°C,ΔNot呈正电荷性,Ts<110°C,ΔNot呈负电荷性。Si-O-Si伸缩振动吸收峰位在1060~1080cm-2间,随Ts的减少而增加。 Effects of deposition conditions on the interfacial properties of the CVD SiO 2 formed by vacuum ultraviolet (VUV)light are studied using high frequency(1 MHz) capacitance voltage( C V ) test and infrared(IR) spectroscopy. It has been shown that the effect of substrate temperature( T s) on the fixed oxide charge density(Δ N ot ) and slow interface state density(Δ N st ) is more notable than the total pneumatic of the reaction chamber and the part pneumatic ratio of SiH 4/O 2. Δ N ot and Δ N st have minimum values in the order of 10 10 cm -2 for T s near 110 °C. Δ Ν ot is positive for T s greater than 120 °C, and negative for T s less than 110 °C.
出处 《微电子学》 CAS CSCD 北大核心 1998年第3期172-175,共4页 Microelectronics
关键词 光CVD 半导体 光化学汽相淀积 Semiconductor process, Semiconductor material, High frequency C V characteristics, SiO 2/Si interface, Photo CVD
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