含硅环氧树脂的制备及其固化动力学研究

The Preparation and Curing Kinetics of the Silicon-Containing Epoxy Resin

采用二苯基硅二醇与邻甲酚醛环氧树脂在SnCl2催化作用下合成了含硅环氧树脂(CNE-Si),并用FT-IR、1H-NMR对产物进行了结构表征,采用TGA分析了含硅环氧树脂的热稳定性。结果表明,-Si-基团的引入大大提高了环氧树脂的热稳定性。采用非等温DSC方法探讨了含硅环氧树脂的固化反应过程,用T-φ外推法确定了含硅环氧树脂在线性酚醛树脂固化剂作用下的固化工艺参数,即:起始固化温度为110℃,最快的固化反应温度为125℃,后固化温度在170℃附近。用Kissinger和Ozawa法进行了动力学研究,得到了其固化反应活化能、反应级数等动力学参数,为含硅环氧树脂的应用提供了基础数据。

Silicon--containing epoxy resin （CNE- Si） was synthesized from diphenylsiandiol （DPSD） and ortho- cresol novolac epoxy resin with SnCl2 as catalyst. The chemical structure of CNE--Si prepared was characterized by FT--IR, ^1H-- NMR. The thermal stability was analyzed by TGA. The results show that the --Si-- group enhanced the thermal stability of the epoxy resin. The curing kinetics of the system is studied by isothermal DSC. The kinetic parameters of the curing reaction including the activation energy and reaction order are calculated using Kissinger and Ozawa method, which offer basic date for the application of CNE--Si.