摘要
计算机CPU芯片集成度和运算速度不断提高,芯片冷却问题成为该领域的重要研究课题。针对目前的技术水平,液体循环冷却作为成熟的、具有竞争力的实用技术之一,利用具有自吸性能的微小型多腔体串联压电泵构造CPU芯片液体冷却系统可减小系统体积、提高散热性能,符合计算机的发展方向;所用压电泵输出流量可达到1260mL/min,输出压力大于15kPa,自吸性能为5kPa,系统冷却测试结果表明:在环境温度25℃、发热功率120W时,该系统冷却平衡温度比风冷散热器低10℃,比热管冷却系统低6℃。
A novel CPU water cooling system with a miniature multi-chamber piezo-pump can reduce the system dimension and enhance the cooling performance. The experiment on the cooling performance of the system was conducted using a piezo-pump with the maximum flow rate of up to 1260 mL/min, the output pressure of more than 15kPa, and the suck pressure of 5kPa. The result shows that the balance temperature of the present water cooling system was 10℃ lower than that of a fan cooling system and 6℃ lower than that of a heat pipe cooling system when the heat power was 120W and the environment temperature was 25℃.
出处
《制冷学报》
CAS
CSCD
北大核心
2009年第3期30-34,共5页
Journal of Refrigeration
基金
国家科技部技术创新基金(07C26222210188)资助项目~~
关键词
热工学
芯片冷却技术
液体冷却
压电泵
散热系统
Pyrology
Chip cooling technology
Water cooling
Piezo-pump
Heat transfer system
