摘要
研究了添加合金元素Ag对Sn9Zn无铅钎料显微组织、在铜基上的润湿性能及对钎料/铜界面组织的影响。研究结果表明:当Ag的含量(质量分数,下同)在0.1%~0.3%时,钎料中针状富zn相逐渐减少,当Ag的含量在0.5%~1%时,钎料中出现Ag—Zn化合物相;当Ag的含量为0.3%时,钎料具有最好的润湿性能,当Ag的含量为0.5%~1%时,钎料的润湿性能下降;Sn-9Zn/Cu的界面处形成平坦的Cu。Zn。化合物层,当Ag含量为0.3%时,在Cu5Zn8化合物层上出现节结状的AgZn3化合物相,随着Ag含量的提高,这种节结状的AgZn3化合物相逐渐聚集长大成扇贝状的化合物层。
The effect of Ag addition in Sn-9Zn solder on its microstrueture and wettability was investigated, and interfaeial structure of solder/Cu was also examined. Results show that, when the addition of Ag is lower than 0.3%, the needle-like Zn-rich phases decrease gradually. But when the content of Ag is between 0.5% and 1%, Ag-Zn intermetallic compounds appear in the solders. When the content of Ag is 0.3%, the solder presents the best wettability. When the content of Ag reaches 0. 5%- 1%, the wettability decreases. Intermetallic compound formed at the Sn-Zn/Cu interface is a planar layer (Cu5Zn8). As for the Sn-Zn-0.3Ag/Cu interface, additional nodules (AgZn3) are visible beside the aforementioned planar layer. And the additional nodules grow up to a scalloped layer gradually as the content of Ag increases.
出处
《材料工程》
EI
CAS
CSCD
北大核心
2009年第6期60-63,共4页
Journal of Materials Engineering
基金
2007年江苏省高等学校大学生实践创新训练计划项目(苏教高(2007)17号)
关键词
无铅钎料
显微组织
润湿性
界面
lead-free solder
microstructure
wettability
interface