SiC/Al基电子封装复合材料的无压浸渗法制备与热性能研究

Presureless Infiltration and Thermal-properties of SiC Porous Ceramics Reinforced Al Composites for Electronic Packaging

用网格堆积法制备SiC多孔陶瓷,以此作为增强体,用无压浸渗工艺制备45%～65%体积分数的SiC/Al基电子封装复合材料,测定25～300℃热导率和热膨胀系数。实验结果表明,增强体经高温氧化处理后能显著的改善SiC/Al的浸润性能;提高浸渗温度和延长浸渗时间可以改善浸渍效果,浸渗温度在1050℃,浸渗时间5h浸渗效果最好;Mg是促进浸渗的有利因素,可有效改善铝在增强体内的渗透深度。该工艺制备的SiC/Al复合材料,热膨胀系数较经典模型计值低,热导率达189W(m.K),可以较好的满足电子封袋材料的要求。

The 45-65% high volume fraction SiC porous ceramics reinforced Al composites for electronic packaging were fabricated using a pressureless infiltration process, SiC porous ceramics that were fabricated by template as reinforcements, and their thermo-physical properties, such as thermal conductivity and coefficient of thermal expansion, were measured in the temperature range of 25-200℃. It shows that infiltration properties of SiC/Al were obviously improved after the reinforcements oxidized by high temperature, and it was helpful for infiltration effectiveness by increasing infiltration temperature and extending infiltration time, the infiltration effectiveness was the best where infiltration temperature was 1 050℃ and infiltration time was 5 hours. Magnesium as the advantage factor, it can effectively improved infiltration depth of Al into SiC porous ceramics. Thermal expansion coefficients of SiC porous ceramics reinforced Al composites were lower than the calculated values of classical model, which was depended on SiC porous ceramics coefficients of thermal expansion. The thermal conductivity of SiC porous ceramics reinforced Al composites was 189 W/（mK）. The SiC/Al composite is a good material in electronic packaging materials.