摘要
在分析TE21模耦合器经典设计方法基础上,针对毫米波段孔壁厚度对耦合的影响,提出了一种新的孔径分布方法,即孔直径由两部分组成:第一部分由参考孔直径乘常系数加权Bessel耦合函数确定;第二部分由常系数乘镜像孔的常系数加权Bessel耦合函数。此孔径分布法经数值计算验证有效,在此基础上设计了毫米波段TE21模耦合器样机,样机实测特性指标与数值计算结果吻合,在(f0±1)GHz范围内,耦合度小于0.6 dB,抑制度大于40 dB,达到预期的技术要求。
To counter the negative effects of shell thickness on TE21 mode coupling in millimeterwave, a new hole diameter distribution is put forward. The quantity of a hole diameter consists of two parts, one part is determined by reference hole diameter multiplying constant weighting Bessel coupling function, and the other part is determined by constant multiplying the constant weighting Bcssel coupling function of its mirror hole. This method of hole distribution has been verified by numeric simulation. On the basis of analysis and numeric simulation, one 8-arm millimeter-wave TE21 mode coupler with 48-hole array is designed with this method. Within (f0±1) GHz range interested, the coupling of TE21 mode is less than 0.6 dB and the mode is greater than 40 dB, which is up to the expected indexes.
出处
《信息与电子工程》
2009年第3期197-201,共5页
information and electronic engineering
关键词
毫米波
数值计算
孔壁厚度
TE21模耦合器
孔径加权
millimeter-wave
numeric simulation
shell thickness
TE21-mode coupler
weighted hole diameter