摘要
以硫酸为反应试剂,对电子印刷线路板生产过程中产生的含铜污泥进行浸出研究。考察了硫酸浓度、液固比、浸出温度和反应时间对浸出的影响。实验结果表明:对于5g干污泥,在室温下,2mol/L的硫酸浓度,5∶1的液固比,浸出2h,铜的浸出率可以达到90%以上。
The captioned leaching was carried out with sulphuric acid used as the reagent. The effect of acid concentration, liquid-to-solid ratio and temperature and time of reaction on leaching was studied. The results show that under the conditions of room temperature, 2 mol/L sulphurie acid, 5：1 liquid-to- solid ratio and two hours of the reaction time, 90% of copper earl be leached out from a portion of sludge containing 5 gram dry solid material.
出处
《上海有色金属》
CAS
2009年第2期63-65,共3页
Shanghai Nonferrous Metals
基金
上海市重点学科(S30109)
上海大学创新基金(A10011107012)资助
关键词
印刷线路板
含铜污泥
硫酸
液固比
浸出率
printed circuit board （PCB）
sludge containing copper
sulphurie acid
liquid-to-solid ratio
rate of leaching
