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UHF power amplifier design in 0.35μm SiGe BiCMOS

UHF power amplifier design in 0.35μm SiGe BiCMOS
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摘要 A two-stage power amplifier operated at 925 MHz was designed and fabricated in Jazz' s 0.35μmSiGe BiCMOS process.It was fully integrated excluding the inductors and the output matching network.Under a single 3.3V supply voltage,the off-chip bonding test results indicated that the circuit has a smallsignal gain of more than 24dB,the input and output reflectance are less than- 24dB and-10dB,re-spectively,and the maximal output power is 23.5 dBm.At output power of 23.1 dBm,the PAE(poweradded efficiency)is 30.2%,the IMD2 and IMD3 are less than- 32 dBc and-46 dBc,respectively.The chip size is 1.27mm ×0.9mm. A two-stage power amplifier operated at 925 MHz was designed and fabricated in Jazz' s 0.35μm SiGe BiCMOS process. It was fully integrated excluding the inductors and the output matching network. Under a single 3.3V supply voltage, the off-chip bonding test results indicated that the circuit has a small signal gain of more than 24dB, the input and output reflectance are less than - 24dB and - 10dB, respectively, and the maximal output power is 23.5 dBm. At output power of 23.1 dBm, the PAE (power added efficiency) is 30.2%, the IMD2 and IMD3 are less than -32 dBc and -46 dBc, respectively. The chip size is 1.27mm × 0.9mm.
出处 《High Technology Letters》 EI CAS 2009年第2期147-150,共4页 高技术通讯(英文版)
基金 Supported by the High Technology Research and Development Programme of China (2006AA03Z418)
关键词 BICMOS工艺 放大器设计 高频功率 SiGe 最大输出功率 功率放大器 小信号增益 匹配网络 power amplifier, SiGe, BiCMOS, heterojuncfion bipolar transistor
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参考文献7

  • 1Rippke I,,Duster J,Kornegay K.A fully integrated, singlechip handset power amplifier in SiGe BiCMOS for W-CDMA applications[].Proceedings of the Microwave Symposium Digest IEEE MTT-S International.2003
  • 2Wang A,Xiaokang Guan,Haigang Feng, et al.A 2. 4 GHz fully integrated class-a power ampifier in 0. 35μm SiGe BiCMOS technology[].Proceedings of the th International Conference On ASIC.2005
  • 3WIN Semiconductors Corp.Design of HBT for Power Amplifier Application-Note AN001. http://www. winfoundry. com . 2008
  • 4Cripps Steve C.RF Power Amplifiers for Wireless Communications[]..1999
  • 5Kitlinski K,Donig G,Kapfelsperger B,et al.Si-Ge power amplifier for WCDMAhandheld applications[].thInternational Conference on MicnowaveRadar and Wireless Communication.2004
  • 6Carrara F,Scuderi A,Bottiglieri G,et al.Silicon bipolar linear power amplifier for WCDMA mobile applications[].IEEE Interna-tional Symposiumon Circuits and Systems.2005
  • 7JOSEPH A J,Harame D L,Jagannathan B,et al.Status and direction of communication technologies?SiGe BiCMOS and RFCMOS[].Proceedings of the IEEE.2005

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