电子产品热设计原理及其散热面积的计算

The Thermal Design Theory of Electronic Products and the Calculation of Its Area of Heat Dissipation

电子产品的可靠性是指产品在规定时间内、规定条件下、完成规定功能的能力。热设计是影响电子产品可靠性的关键技术之一。为提高元器件和设备的热可靠性,以及对各种恶劣环境条件的适应能力,使电子元器件和设备的热控制和热分析技术得到了普遍的重视和发展。本文将以实际应用为例,简述热设计的基本原理,以恶劣工作条件下的电子产品为实际例子,计算其散热面积的大小。

The reliability of electronic products refers to the product＇s ability to complete the function, in the specified time, the provisions of conditions. Thermal design of electronic products is one of the key technologies to affect the reliability. Thermal control and thermal analysis technique of electronic components and equipment have gained widespread attention and development in order to improve the reliability of thermal component and equipment and the ability to adapt to a variety of bad environment. This article describes the basic principle of thermal design based on its practical application and calculates its area of heat dissipation by taking the electronic products working in tough environment as an example.