摘要
针对拆除力对电子元件拆除工艺和效果的影响,分析了表面贴装元件(SMD)和通孔安装元件(THD)两类电子元件的拆除力影响因素,应用黏性流体力学和材料力学理论分别建立了SMD和THD两类电子元件的拆除力模型,分析了两类元件在不同条件下所需的最小拆除力,拆除实验结果显示了模型的合理性。实验表明,SMD元件水平拆除力比垂直拆除力大得多,而引脚的弯曲程度和数量是影响THD元件拆除力的关键因素,SMD、THD元件应予以分别拆除。
The factors of dismantling force for surface mount devices（SMD） and through hole devices（THD） were analyzed, and the dismantling force model for SMD and THD was established by viscous fluid mechanics principle and material mechanics theory. The minimal dismantling forces of the above mentioned two kinds of components were also calculated, and the results of dismantling experiments show that this model is reasonable. The experiments indicate that horizontal dismantling force of SMD is more greater than vertical dismantling force, and the bend level and quantities of leg wire are the key factors of THD＇s dismantling force, meanwhile the two kinds of components should be treated separately during the dismantling process.
出处
《中国机械工程》
EI
CAS
CSCD
北大核心
2009年第12期1394-1398,共5页
China Mechanical Engineering
基金
国家“十一五”科技支撑计划项目(2006BAF02A17-2)
关键词
印刷电路板
拆除力
电子元件
模型
实验
printed circuit board
dismantling force
electronic component
model
experiment
