SiC含量和热压烧结温度对AlN-SiC复相陶瓷材料导热性能的影响

Effect of SiC Content and Hot Press Sintering Temperature on Thermal Conductivity Property of AlN-SiC Composites

采用热压烧结工艺制备了AIN-SiC复相陶瓷材料，用XRD、SEM和激光导热仪等研究了SiC加入量和烧结温度对复相陶瓷材料导热性能的影响。结果表明：当质量分数在20％～75％范围内，随着SiC含量的增加，复相陶瓷材料的热导率逐渐增大，最大热导率达到了88．92W·m^-1·K^-1；进一步增加SiC的含量，复相材料的热导率叉呈现下降趋势，当SiC质量分数为80％时，热导率降到了42．70W·m^-1·K^-1；当SiC质量分数为20％时，随着烧结温度的升高（1800-1950℃），复相陶瓷材料的热导率逐渐上升，从42．15W·m^-1·K^-1增加到68．41W·m^-1·K^-1。

AlN-SiC composites were prepared by hot press sintering. The effect of SiC content and sintering temperature on the thermal conductivity property of the composites were investigated by means of XRD, SEM and laser thermal conductivity apparatus. The results show that when the SiC content was in the range of 20^%--75%, the thermal conductivity increased gradually with the increase of SiC content and the maximal thermal conductivity reached 88. 92 W·m^-1·K^-1. When the SiC content continued increase, the thermal conductivity of the composite decreased. When the SiC content was 80%, the thermal conductivity decreased to 42. 70 W·m^-1·K^-1. When the SiC content was 20%, the thermal conductivity increased from 42.15 W·m^-1·K^-1 to 68. 41 W·m^-1·K^-1 gradually with the increase of sintering temperature （1 800--1 950 ℃）.