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New development of atmospheric pressure plasma polishing 被引量:1

New development of atmospheric pressure plasma polishing
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摘要 Atmospheric pressure plasma polishing (APPP) high quMity optical surfaces. The changes of is a precision machining technology used for manufacturing surface modulus and hardness after machining prove the distinct improvement of surface mechanical properties. The demonstrated decrease of surface residual stresses testifies the removal of the former deformation layer. And the surface topographies under atomic force microscope (AFM) and scanning electron microscope (SEM) indicate obvious amelioration of the surface status, showing that the 0.926-nm average surface roughness has been achieved. Atmospheric pressure plasma polishing (APPP) high quMity optical surfaces. The changes of is a precision machining technology used for manufacturing surface modulus and hardness after machining prove the distinct improvement of surface mechanical properties. The demonstrated decrease of surface residual stresses testifies the removal of the former deformation layer. And the surface topographies under atomic force microscope (AFM) and scanning electron microscope (SEM) indicate obvious amelioration of the surface status, showing that the 0.926-nm average surface roughness has been achieved.
出处 《Chinese Optics Letters》 SCIE EI CAS CSCD 2009年第6期537-538,共2页 中国光学快报(英文版)
基金 supported by the National Natural Science Foundation of China (Nos.50535020 and 50775055) the Defense Advanced Research Foundation (No.9140A180202-06HT0132) the Natural Science Foundation of Heilongjiang Province (No.E200622)
关键词 Atmospheric pressure MACHINING Mechanical properties MICROSCOPES Plasma sources POLISHING Precision engineering Scanning electron microscopy Surface roughness Atmospheric pressure Machining Mechanical properties Microscopes Plasma sources Polishing Precision engineering Scanning electron microscopy Surface roughness
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参考文献6

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同被引文献12

  • 1Kim Dae Wook, Martin Hubert M, Burge James H. Calibration and optimization of computer-controlled optical surfacing for large optics [ C ]//Proc of SPIE. 2010, 8126 : 812615.
  • 2Markus Schinhaerl, Richard Stamp, Elmar Pitschk, et al. Advanced techniques for computer-controlled polishing [ C ]//Proc SPIE, Current Developments in Lens Design and Optical Engineering IX. San Diego, California, USA, 2005, 7060 : 70600Q-1.
  • 3Yamamura K, Yamauchi K, Mimura H, et al. Fabrication of elliptical mirror at nanometer-level accuracy for hard X- ray focusing by numerically controlled plasma chemical vaporization machining [ J ]. Review of Scientific Instruments, 2003, 74(10) : 4549-4553.
  • 4Mori Y, Yamamura K, Yamauchi K, et al. Plasma CVM (chemical vaporization machining) : An ultra-precision machining technique using high-pressure reactive plasma [ J ]. Nanotechnology, 1993,4(4) : 225-229.
  • 5Yamamura K, Shimada S, Mori Y. Damage-free improvement of thickness uniformity of quartz crystal wafer by plas- ma chemical vaporization machining [ J ]. CIRP Annals- Manufacturing Technology, 2008, 57( 1 ): 567-570.
  • 6Fanara Carlo, Shore Paul, Nicholls John R, et al. A new reactive atom plasma technology (RAPT) for precision machining : The etching of ULE optical surfaces [ C ]//Proc of SPIE. Orlando, FL, 2006, 6273.
  • 7Castelli Marco, Jourdain Renaud, Morantz Paul, et al. Reactive atom plasma for rapid figure correction of optical surfaces[J]. Key Engineering Materials, 2012, 96 : 182-187.
  • 8William John O'Brien. The Characterizations and Material Removal Properties of the Reactive Atom Plasma ( RAP^TM ) Process [D]. UK: Cranfield University, 2011.
  • 9王波,张巨帆,董申,等.常压等离子体抛光方法:中国,200710072022.9[P].2009-02-18.
  • 10郑国经,计子华,余兴.原子发射光谱技术及应用[M].北京:化学工业出版社,2009.

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