激光在高密度PCB制造中的应用研究

The Application Research of Laser in High-Density PCB Manufacture

传统机械钻削难以满足高密度PCB微细孔的加工要求。试验表明,通过对激光波长模式、光斑直径和脉冲宽度等参数的精确控制,及利用激光束对材料相互作用的效应加工高密度PCB微孔,不仅能达到的较好加工质量,同时还体现出激光打孔快速、精准的优势。

The traditional machine drilling can＇t appease the requirement in the microvia formation of high-density PCB manufacture. With laser drilling PCB microvia and with exactlly control wavelength, mode, diameter and pulse can reach the quality demand. Analysis beam effects between interaction material. Represent the advantage of laser drilling for quick and precision.