摘要
介绍了国内外环氧灌封材料的生产现状及其在电子封装业中的发展前景,并概述了对现代电子封装材料的环保新要求及电子封装无卤化阻燃对环氧树脂提出的挑战。
The production status of encapsulating material at home and abroad and development prospect of epoxy encapsulating materials in electronic packaging industry were introduced. The new requirements of electronic packaging materials about environmental protection were summarized, at the same time a new challenge to epoxy resin from non-halogenated flame-retardant of electronic packaging was proposed.
出处
《塑料助剂》
2009年第3期6-9,共4页
Plastics Additives
关键词
环氧树脂
灌封料
阻燃
epoxy resin
encapsulating material
flame retardancy
