摘要
PCB板级组装作为电子产品生产的重要环节之一,越来越显示它的重要性,组装的可靠性成为电子产品竞争力的重要体现。通过对影响板级组装可靠性主要因素的分析,从元器件的合理选用、基板的选择、元件的布局和方向设计、SMT焊膏印刷以及回流焊的质量控制5个方面就提高PCB板级组装的可靠性进行了论述,并提出了提高PCB板级组装可靠性的方法和路径。
As a key component in production of electronics products, PCB - level assembly has become more and more important, the reliability of assembly has become important aspect of electronic products competitiveness. Through analyzing major factors of board - level assembly reliability, how to improve board - level assembly reliability is discussed through rational selecting of electronic devices, design of base bord, general layout of devices, solder - paste printing of SMT and quality control of reflow soldering, method and ways to improve PCB assembly board reliability are proposed.
出处
《电讯技术》
北大核心
2009年第6期84-87,共4页
Telecommunication Engineering
