摘要
医用电子器械特别是植入人体的医用电子器械,其封装与连接是否漏气、漏电流,直接影响到它的可靠性与有效性。该文介绍了一种新的微渗漏检测方法——CHLD(Cumulative Helium Leak Detection累积式氦渗漏测试)方法。
To the medical electronics particularly the implant medical device, the seal packing and connection whether leaks the gas or liquid, can directly effect its reliability and efficiency. This paper introduces a new method for detecting the micro - leak, that is, Cumulative Helium Leak Detection (CHLD) method.
出处
《生物医学工程学进展》
CAS
2009年第2期121-123,共3页
Progress in Biomedical Engineering