高速高稳定性化学镀镍工艺

The Electroless Plating Process for Nickel with High Depositing Speed and Stable Electrolyte

研究了化学镀镍液中主盐、还原剂、络合剂、加速剂等各种组分对镀速的影响，确定了工艺条件，研制了ＢＨ化学镀镍新工艺。采用该工艺，２ｈ平均镀速可达２５μｍ／ｈ，镀液寿命可达７个周期以上。采用ＥＤＡＸ方法测定了镀层磷含量，Ｘ射线衍射图表明镀层为典型的非晶态结构，性能检测表明：镀层有较高的硬度和好的耐磨性，耐蚀性优于１Ｃｒ１８Ｎｉ９Ｔｉ不锈钢。

The effect of the constituents of the nickel plating solution were studied,ie the nickel salt,reducting agent,complexing agent and accelerating agent ect on the depositing rateThe processing procedure was determined and a new type BH electroless nickel plating procedure was selected succesfullyWith this processing procedure,the deposite rate can reach 25μm/h and overThe life time of the solution can last more than 7 periodsThe phosphor content was analyzed with an EDAX attached to a SEMThe result abtained from the Xray diffraction analyzer showed that the partern of the deposited layer was a typical noncrytal structureThe examination of the deposit properties indicated that the hardness and the abrasion resistance of the deposit were relative high,the corrosion resistance of it was superior to 1Cr18Ni9Ti stainless steel