利用歧化反应法化学镀锡

CHEMICAL TINPLATING OF USING DISPROPOR TIONATION

利用Ｓｎ２＋在强碱性条件下易发生歧化反应生成金属锡，提出了一种不必加还原剂而直接施镀的新型化学镀锡方法．讨论了镀液各组成浓度及施镀温度等对析出速度和镀层厚度的影响．试验结果表明，当镀液组成为ＳｎＣｌ２·２Ｈ２Ｏ０．２～０．４ｍｏｌ／Ｌ，ＮａＯＨ３～５ｍｏｌ／Ｌ，Ｎａ３Ｃｉｔ０．３～０．５ｍｏｌ／Ｌ，施镀温度为７０℃左右时，有很好的析出速度和镀层厚度．

Sn2+ can easily undergo disproportionation in the presence of strong base, and produce metal Tin. Based on this reaction, the article discusses effects of concentration of each components in the plating solution and plating temperature on separating speed and the thickness of the plating layer. The test result shows: when plating solution is SnCl2·2H2O 0.2～0.4 mol/L, NaOH 3～5 mol/L, Na3Cit 0.3～0.5 mol/L, and the plating temperature is 70 ℃, better separating speed and thicker plating layer are obtained.