磨料水射流切割半导体材料的研究

Study on the Abrasive Waterjet Cutting of Semiconductor Materials

由于水射流技术的加工效果的优越性,人们日益注重对添加磨料的水射流技术的开发和应用,主要就磨料水射流切割的半导体材料进行了研究。

Because of water jet technology, the advantages of processing effect, there is a growing emphasis on adding abrasive water jet technology development and applications. In this paper, the materials of abrasive water jet cutting of semiconductor were mainly studied on.