W-Cu触头材料的微波烧结

Microwave sintering of W-Cu contact materials

采用微波烧结技术制备W-25Cu触头材料,并与常规烧结进行对比。结果表明:微波烧结升温速度快,周期短,能促进W-Cu材料的致密化;在适当条件下,微波烧结能获得相对密度达99.8%的W-Cu样品;微波烧结能改善W-Cu样品中两相分布的均匀性和W晶粒尺寸的一致性,但引起W晶粒的快速长大;Fe烧结助剂导致W-Cu材料显微组织均匀性变差,并引起晶粒进一步粗化;微波烧结技术能够应用于W-Cu材料的制备,在缩短生产周期、降低生产成本方面具有潜在优势。

Microwave sintering of W-25Cu composites was presented, along with conventional sintering for a comparison. The experimental results show that microwave sintering promotes the densification of green compacts with higher heating rate and reduced sintering cycle. The sintered relative density of 99.8% can be achieved during microwave processing under appropriate conditions. In addition, microwave sintering improves the uniformity and homogenization of W grain size, and yet leads to growth of W grain. Fe sintering aid degrades the microstructure uniformity and further coarsens W grains. The present investigation demonstrates the feasibility of applying microwave sintering technique to eorisolidate W-Cu composites and its promising outlook in reducing production cycle and cost.