摘要
阐述了激光与半导体相互作用机理，通过激光直接写技术（ＬＤＷ）及等离子体软ｘ射线源等具体实例，说明了激光在半导体材料加工中的应用。给出了实验结果，并对其前景作了展望。
The effect mechanism on laser and semiconductor material is expounded in this paper.Application of laser processing in semiconductor material was given by using practical examples on techniques of laser direct draw and plasma soft x-ray source.The experimental result was given,and application prospect was discussed.
出处
《半导体技术》
CAS
CSCD
北大核心
1998年第4期5-7,4,共4页
Semiconductor Technology
