晶片焊线机视觉检测算法研究

Study on the Algorithms of Vision Detection of Automatic Chip Wire Bonder

全自动晶片焊线机是晶片生产的关键设备之一,其视觉检测系统是设备的核心技术所在。视觉检测技术直接影响晶片检测定位精度和焊接机的工作效率。分析了晶片检测原理和方法,研究了基于图像处理技术的晶片检测和定位算法,着重讨论了灰度模板匹配和二值模板匹配的方法。实验表明,系统在速度和精度上都可满足焊线生产的需求。

The automatic chip wire bonder is one of the primary equipments for chip production. The analyzed, and the algorithms of detection and location based on image processing tenology were presented. The matching algorithms were discussed emphatically in the gray image template and the binary image template. The speed and accuracy of the algorithms are good enough to meet the practical application requirement.