期刊文献+

导热SiC/LLDPE复合塑料制备及性能研究 被引量:6

Preparation and Properties of Thermal Conductive SiC/LLDPE Composite Plastics
下载PDF
导出
摘要 采用碳化硅(S iC)和线性低密度聚乙烯(LLDPE)粒子经粉末混合和热压成型制得导热复合塑料。研究了S iC粒子含量对LLDPE熔融温度、结晶度、热导率、介电及力学性能的影响。结果表明:S iC粒子降低了LLDPE结晶度,对熔融温度无明显影响;随S iC含量增加,热导率升高,介电常数和损耗升高,但仍然保持在较低数值,而力学性能下降。 A thermally conductive composite plastics was obtained form a particles mixture of silicon carbide (SiC) and linear low-density polyethylene (LLDPE) by a powder mixing and hot press molding. The effects of SiC content on the melting temperature, crystallinity, thermal conductivity, dielectric and mechanical properties were investigated. The results demonstrated that the useing of SiC decreased the crystallinity of LLDPE,and had no significant influence on the melting temperature. As an increasing in SiC concentration, the thermal conductivity rose, the dielectric constant and loss increased, however, they still remained relatively low values. The mechanical properties of filled LLDPE obviously decreased with increasing the content of SiC.
出处 《塑料》 CAS CSCD 北大核心 2009年第3期56-60,共5页 Plastics
关键词 线性低密度聚乙烯 碳化硅 热导率 介电性能 粉末混合 LLDPE silicon carbide thermal conductivity dielectric properties powder mix
  • 相关文献

参考文献14

  • 1Zhou W Y,Qi S H,An Q L. Thermal conductivity of boron nitride reinforced polyethylene composites[ J ]. Material Research Bulletin, 2007,42(10) :1863 - 1873.
  • 2马传国,容敏智,章明秋.导热高分子复合材料的研究与应用[J].材料工程,2002,30(7):40-45. 被引量:102
  • 3Kondo Toshiki. Polyamide Composition for Housing of Electronic Parts: JP,03 79 666[ P]. 1991 -04 -04.
  • 4Kikuma Shinji. Highly Thermally Conductive Heat-Resistant Thermoplastic Resin Composition for Metal Printed Circuit Boards :JP ,02 110 125[P]. 1990 - 04 - 25.
  • 5汪雨荻,周和平,乔梁,陈虎,金海波.AlN/聚乙烯复合基板的导热性能[J].无机材料学报,2000,15(6):1030-1036. 被引量:68
  • 6Agari Y,Ueda A, Nagai S. Thermal conductivity of composites in several types of dispesion systems[ J]. J Appl Polym Sci, 1991, 42(6) :1665 - 1669.
  • 7Yu S Z, Hing P, Hu X. Thermal conductivity of polystyrene-aluminum nitride composite [ J ]. Composites ( Part A) ,2002,33 ( 5 ) :289 - 292.
  • 8Zhou W Y, Qi S H, Li H D. Study on insulating thermal conductive BN/HDPE composites[J]. Thermochim Acta, 2007, 452( 1 ), 36 -42.
  • 9Rusu M, Sofian N, Rusu D. Properties of iron powder filled high density polyethylene [ J]. Journal of Polymer Engineering, 2001,21 (5) : 469 -487.
  • 10Alamo R G,Graessley W W,Krishnamoorti R. Small angle neutron scattering investigations of melt miscibility and phase segregation in blends of linear and branched polyethylene as a function of the branch content [ J ]. Macromolecule, 1997,30 ( 3 ) :561 - 566.

二级参考文献36

  • 1Chen X H,J Mat Res,1997年,12卷,5期,1274页
  • 2Li L,J Electron Mater,1994年,23卷,6期,557页
  • 3Procter P,Solc J.Improved thermal conductivity in microelectronic encapsulants[ C ].Dexter's Technical Paper,1999(2):1 -8.
  • 4Pecht MG,Nguyen LT,Hakim EB.Plastic encapsulated microelectronics[ M ].New York:Wiley,1995.
  • 5Bujard P,Kuhnlein G,Ino S,et al.Thermal conductivity of molding compounds for plastic packaging[ J].IEEE Trans Compon Hybrids Manuf Tchnol (Part A),1994,17 (4):527.
  • 6Procter P,Solc J.Improved thermal conductivity in microelectronic encapsulants[J].IEEE Trans Compon Hybrids Manuf Technol,1991,14 (4):708.
  • 7Ishida H,Rimdusit S.Very high thermal conductivity obtained by boron nitride-filled polybenzoxazine.Thermochim acta,1998,320:177.
  • 8Choy C L,Luk W H,Chen F C.Thermal conductivity of highly oriented polyethylene[ J ].Polymer,1978 19 (2):155-162.
  • 9F Danes,B Garnier,T Dupuis.Predicting,Measuring,and Tailoring the transverse thermal conductivity of composites from polymer matrix and metal filler[J].International Journal of Thermophysics,2003,24(3):771.
  • 10Hill R F.In proceedings of technical program of the SMTA national symposium-emerging packaging technologies[ C].Research Triangle Park,NC,1996.

共引文献161

同被引文献58

引证文献6

二级引证文献20

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部