基于乙醛酸作还原剂的新型化学镀铜工艺研究

Research on Electroless Copper Plating Process Using Glyoxylic Acid as Reducing Agent

研究了乙醛酸化学镀铜体系中各因素对镀速和溶液稳定性的影响,根据实验确定了适宜的化学镀铜液的配方及工艺规范。优化工艺条件:硫酸铜16g/L,乙二胺四乙酸二钠30g/L,乙醛酸13g/L,2,2′-联吡啶10mg/L,pH12.5,温度40℃。优化条件下,可获得结合力良好、表面均匀光亮的镀层,工艺中不使用甲醛,无污染,具有良好的环境效应及社会效应,应用前景广阔。

Factors affecting on plating rate and solution stability were studied for glyoxylic acid reduced electroless copper plating system. A proper composition of the plating solution was obtained as follows： copper sulfate 16 g/L, EDTA .2Na 30 g/L, glyoxylic acid 13 g/L, 2,2＇- bipyridine 10 mg/L. The optimal pH and temperature were 12.5℃ and 40℃, respectively. The process is environmentally benign with no formaldehyde.