摘要
确定了光刻胶的光刻工艺条件，研制出了适宜的显影液，介绍了感光树脂的应用价值。
The photolithographic conditions of polyimade photoresist are preferably defined in this paper.The adequate developer of the photoresist is studied and produced .The appliable value of the photosensitive resin is showed.
出处
《河北化工》
1998年第1期21-23,共3页
Hebei Chemical Industry
关键词
光刻胶
光敏聚酰亚胺
曝光
显影
固化
微电子学
photoresist,photosensitive,polyimade,exposure,soft-bake,development,cure
