小型电子元件用低粘度耐高低温环氧灌注胶的研究

Epoxy Impregnating Resin with Low Viscosity and High Resistance to High and Low Temperature Shock for Miniature Electronic Components

通过对环氧灌注体系的各个组成的考察,并结合小型电子元件的特殊性进行研究,制得由混合环氧树脂与酸酐共混固化剂和增韧剂端羧基丁腈橡胶及其他助剂组成的环氧灌注体系。试验研究表明,该产品具有良好的流动性、力学性能和耐高低温冲击性能;便于小型元件中细小孔径的灌注,不易产生气泡,保证了其运行的稳定性。

An epoxy impregnating system composed of blended epoxy resin and anhydride curing agent, carboxyl-terminated butadiene-acrylonitrile rubber（CTBN） toughener and other additives was obtained based on researches on various compositions of epoxy impregnating systems and characteristics of miniature electronic components. Experimental studies reveal that the product has good flowability, high mechanical properties and resistance to high and low temperature shock. That makes it easily impregnate into very small aperture of miniature electronic components without bubble formation and thus the running stability is guaranteed.