竹大片刨花板的防霉处理及其效果

Mold-proof Treatmenton Bamboo-based Waferboard

对竹大片刨花板(BWB)作防青霉处理的试验结果表明:烷基铵类化合物(AAC)防霉剂的抗霉性大于硼酸,且药剂浓度越大则抗霉性越好;防霉剂对青霉菌的抑制效力随时间的延长而逐渐下降;无论酚醛树脂(PF)还是脲醛树脂(UF)对青霉菌基本无抑制作用;AAC表面处理和内部处理赋予竹大片刨花板的抗霉能力基本相同;烷基铵类防霉剂对PF-BWB的力学性能影响不大,但会导致UF-BWB力学性能的大幅下降。

Results from the experiment of anti-Penicillium sp. showed that the effect of mold-proof treatment on bamboo-based waferboard （BWB） with alkyl ammonium compound （AAC） was better than that with boracic acid （H3BO3） and the higher concentration of the dosage, the stronger effectiveness; the mold-proof property of the anti-Penicillium sp. of the different dosages were decreased along with the increase of treatment time; either phenol formaldehyde resin （PF） or urea formaldehyde （UF）one had little mold-proof effect; the mould-proof capabilities of both surface and inner treatment were similar; and there was little impact from AAC treatment on the bonding strength and other main mechanical properties of the BWB bonded with PF, but notable influence on those of that bonded with UF.