摘要
本文将进一步说明,如何不改变电路的设计只需变更驱动芯片的封装型态,进而大幅改善LED显示屏的散热、电磁干扰、组装工时及成本。并针对目前使用的SOP(Small Outline Package)及QFN(Quad Flat No Leads)两种封装型态的热阻、尺寸等比较,及"灯驱合一"及"灯驱分离"之说明。
The article illustrated how to improve thermal, EMC/EMI, assembly time and cost on LED display without changing schematic. Besides, it described the further comparison on θ Ja and package size between SOP （Small Outline Package） and QFN （Quad Flat No Leads）. Finally, it explained the ＂Combo Design＂ and ＂Separate Design＂.
出处
《现代显示》
2009年第7期43-46,共4页
Advanced Display
