摘要
阐述了电磁环境日益复杂的情况下,印制电路板电磁兼容性设计在电子产品设计中的必要性,并在分析印制电路板造成信号传输损失、电磁能量辐射形成机理的基础上对印制电路板设计中影响印制线条阻抗的因素、阻抗匹配的重要性和如何控制信号传输线的阻抗,以及印制电路板的地线结构作了分析,从避免印制电路板形成辐射和提高其抗干扰能力的角度阐述了在印制电路板上如何合理布置地线及地线网格、地线面的应用方法,最后分析了印制电路板的布线原则。
Expatiate requirement of electromagnetic compatibility for design of the printed circuit board in design of electron equipment, under complex circumstance of electromagnetic. Analyse influence factor of impedance of printed circuit line, ponderance of impedance - matching, as well as control method of impedance of transmission line in design of the printed circuit board, based on analysing loss of signal for transmission line and essential of radiation for electromagnetic energy. Analyse layout of groundline in the printed circuit board, discuss layout method of groundline - grid and groundline - plane, based on avoiding electromagnetic radiation and increasing electromagnetic susceptibility for PCB. Analyse principle of line layout in the printed circuit board.
出处
《电子工艺技术》
2009年第4期210-213,共4页
Electronics Process Technology
关键词
印制电路板
电磁兼容性
阻抗匹配
耦合
地线网格
地线面
Printed circuit board
Electromagnetic compatibility
Impedance - matching
Coupling
Groundline - grid
Groundline - plane