摘要
文章概述了无铅化热风整平的焊料及其选择。在Sn-Cu中加入少量的Ni(或Co)是无铅化热风整平的焊料的有利选择。
The paper describes that the solder and selection of lead-free solder in HASL.The best-selection of lead-free solder is that the additive-small Ni（or Co） in Sn.Cu systems.
出处
《印制电路信息》
2009年第7期41-45,共5页
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