一种基于光散射原理在线测量晶圆表面质量的方法

Method of in-process measurement of wafer surface quality based on laser scattering principle

在半导体工业中，晶圆表面质量的检测占据着重要的地位。选择粗糙度参数轮廓算术平均偏差R。作为衡量表面质量的参数，根据晶圆的一般粗糙度范围（Rα为0.01—0.8μm），构建了一种基于光散射原理的视觉系统测量装置。通过分析光散射强度分布图像，提取出一些参数来表征Rα，达到检测晶圆表面质量的目的。给出了初步的实验结果，说明了此方案是可行的。

As the basic material of IC chips, the surface quality of wafer plays an important role in the machining process of IC chips. The surface roughness parameter（ Rα, i. e. the arithmetic average height parameter）is chose to evaluate the surface quality of wafer. According to the surface roughness range of silicon wafer （Rα= 0.01—0.8μm）,an optical measurement based on the light scattering principle is established, which is founded on a machine vision system. By analyzing the images of the spatial distribution of the scattered light intensity, some parameters are selected to estimate Rα. Elementary experiment results are shown and the feasibility of this method is demonstrated.