摘要
为了优选酸性氯化铜蚀刻工艺条件,提高工作效率,采用喷射法动态试验,研究了影响印刷线路板铜箔蚀刻速率的因素。结果表明,当氯化铜质量浓度为150～250g/L,盐酸浓度为1.6～3.0mol/L,氯化钾浓度为1.4～1.6mol/L,操作温度50℃左右,试样运动速率2.14m/s时,蚀刻效果最佳,最高蚀刻速率接近60μm/min。适当加大喷淋量有利于提高蚀刻速率。
The factors affecting the etching rate of printed circuit board-used copper foil in an acidic copper chloride solution was studied by dynamic spraying test to optimize the process conditions and improve working efficiency. The results showed that the optimal etching effectiveness is achieved with a etching rate up to 60 μm/min by using a solution containing copper chloride 150-250 g/L, hydrochloric acid 1.6-3.0 mol/L and potassium chloride 1.4-1.6 mol/L at an operating temperature of 50 ℃ and specimen motion rate of 2.14 m/s. The etching rate can be enhanced by appropriately increasing spray amount.
出处
《电镀与涂饰》
CAS
CSCD
北大核心
2009年第7期28-30,共3页
Electroplating & Finishing
关键词
印刷线路板
铜箔
蚀刻
工艺参数
printed circuit board
copper foil
etching
process parameter
