摘要
着重分析了铂电阻温度传感器在封装过程中影响响应时间的因素,提出了在封装过程中为缩短响应时间所应采取的措施。经验证表明,这些措施是有效的。
The influences on response time of the packaging structure of platinum resistance temperature sensor are analyzed, and some methods are advanced for shortening response time in the packaging process. It is proved that these methods are effective.
出处
《导弹与航天运载技术》
北大核心
2009年第3期29-31,共3页
Missiles and Space Vehicles
关键词
温度传感器
响应时间
封装结构
Temperature sensor
Response time
Packaging structure
